Download CHIP SCALE PACKAGE, CSP: Design, Materials, Processes, by John H. Lau,Ricky S.W. Lee PDF

By John H. Lau,Ricky S.W. Lee

the 1st accomplished, in-depth consultant to chip scale packaging, this reference grants state-of-the-art info at the most crucial new improvement in digital packaging due to the fact floor mount know-how (SMT). that includes the newest layout innovations, plus info on greater than forty kinds of CSP, Chip Scale package deal fingers engineers and architects the full, expert set of operating instruments that they should clear up technical and layout matters; locate the best, reasonable CSP strategies for his or her deployments; solution questions about interfacing, pace, robustness, and extra; examine homes of wirebonds, turn chips, inflexible and flex substrates, wafer-level redistribution, and different CSP items; get the most recent info on new choices from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, nationwide Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and different significant businesses; and know about CSP items lower than improvement. A revolution in electronics, CSP is taking the electronics by means of hurricane. web page after web page, this standard-setting advisor grants either crucial technical info and an eye-opening assessment of this fast-developing box. regardless of the way you use Chip Scale package deal, youÕll see why itÕs the source of selection in the event you are looking to be on the most sensible of the game.

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